Critical prediction modeling for integrated circuits (ICs) electromagnetic compatibility (EMC) in smart automotive Industry

Abstract

Driven by the UN 9.4 Sustainable Development Goal (SDG), by 2030, all industries and infrastructures are to be made sustainable with sound technology and industry. Automotive industry, especially the smart vehicle, is facing design challenges like susceptibility towards Electromagnetic Interference (EMI). EMI is a disturbance caused by an external source that affects an electrical circuit through Electromagnetic induction, electrostatic coupling, radiation, or conduction. Any device is said to have Electromagnetic Compatibility (EMC) if its performance is not deteriorated, and it functions error free in its intended Electromagnetic environment and at the same time does not affect the operation of other devices in the Electromagnetic environment. Electronic control devices calculate incorrect outputs because of EMI, and sensors give misleading values. It becomes more severe with double scaling down of the Integrated Circuits (IC) for every two years. Malfunctioning of the IC due to EMI problem can lead to loss of human life and catastrophic accidents as smart vehicle is highly dependent on electronic systems. Many techniques have been used over the years to check the EMC of ICs including both experimental measurement methods and EMC modeling methods. Effective modeling methods have been recently proposed that could predict the EMI situations in the IC. This research aims to develop an optimum modeling methodology for conducted EMI in an IC using the IBIS (Input/Output Buffer Information Specification) models of the test ICs. The objective is to investigate conducted emissions from the IC, develop corresponding noise models using “Total voltage” method and use the built noise source model for a test IC in system-level simulations and obtain the radiation patterns. The proposed methodology is verified by extracting noise sources and developing noise models using “Thevenin equivalent voltage” method and then obtaining the radiation patterns of the IC. The radiation patterns obtained from both Total voltage method and Thevenin equivalent method are compared, and they are found to be in good agreement with a relative difference of around 5% for the best-case scenario and a relative difference of less than 20% for all the cases considered. Apart from considering the Conducted Emissions from an IC, Signal Integrity (SI) issues of the DUT have also been considered in this research. Signal Integrity analysis of the ICs is carried out using IBIS models. This research will be a significant development in investigating the effect of the Conducted Electromagnetic Interference and assessing Electromagnetic Compatibilities at an early stage and also to tackle the Signal Integrity issues at an earlier stage to reduce overall design cost and time-to-market, as well as to improve durability and reliability. However, in future further investigations need to done on the Radiated Electromagnetic Interference.